Microelectronics Failure Analysis Scientist

The Aerospace Corporation is the trusted partner to the nation’s space programs, solving the hardest problems and providing unmatched technical expertise. As the operator of a federally funded research and development center (FFRDC), we are broadly engaged across all aspects of space— delivering innovative solutions that span satellite, launch, ground, and cyber systems for defense, civil and commercial customers. When you join our team, you’ll be part of a special collection of problem solvers, thought leaders, and innovators. Join us and take your place in space.Physical Sciences Laboratories (PSL) supports the effective and timely development and operation of national security systems through scientific research and the application of advanced technologies. PSL has more than 150 specialized laboratories used to test, analyze, and troubleshoot virtually every aspect of rocket and satellite system design, development, construction, deployment, and operation. The expertise of the laboratories’ technical staff allows PSL to stay abreast of new technological developments and program support issues associated with rapidly evolving space systems.The Microelectronics Technology Department (MTD) is part of PSL with specialized laboratories for testing, accelerating, and analyzing, failures in electronics used for space system. MTD is comprised of two sections: one that performs radiation effects testing and discrete microelectronics testing, while the other section performs failure analysis on microelectronics using tools that can identify anomalies from the macroscopic down to the atomic scale.  MTD is looking for a Microelectronics Failure Analysis Scientist (Senior Member of Technical Staff) to support investigations of physics of failure in silicon CMOS, III-V devices, and other materials and technologies for space applications.  Highlights of our lab's capabilities can be seen here: Virtual Tour   The selected candidate will be required to work full-time, on-site at our facility in El Segundo CA.   What You’ll Be Doing Provide technical support to national security space programs, internal, and academic collaborators   Conduct research on microelectronic device technologies for application in space systems, including developing new physical analysis techniques and developing knowledge of hardware security verification Perform failure analysis and anomaly resolution investigations of integrated circuits and other microelectronic devices using physical analysis techniques such as scanning electron microscopy, focused ion beam, electron beam induced current imaging, laser scanning microscopy, atomic force microscopy, or transmission electron microscopyPresent results of assessments/research internally, to customers, at scientific meetings, and publish research in peer-reviewed scientific journals Support the adoption and assessment of new technologies and applications, space systems, including technology qualification and assurance Innovation, velocity, and accountability will primarily be used to assess job performance  Develop capabilities in circuit & device modeling and materials physics simulation What You Need to be Successful Minimum Requirements for the Senior Member of Technical Staff– Microelectronics / Semiconductor Engineering: Master's degree in electrical engineering, computer engineering, materials science, physics, chemistry or related fields is requiredA minimum of (2) years of progressively responsible professional engineering experience, demonstrating a proven track record of technical leadership, innovation, and the ability to solve complex technical challenges is required.Proficient with the operation of dual beam focused ion beam (FIB) scanning electron microscopes (SEM) and energy dispersive spectroscopy (EDS/EDX).Experience with characterization or fabrication of Si-CMOS and III-V semiconductorsKnowledge of physical analysis and fault isolation techniques such as electron microscopy, thermal imaging, focused ion beam, scanning transmission electron microscopy (S/TEM), or electron beam induced current (EBIC) imagingExperience with Python/ MATLAB or similar software for data collection/analysis and simulationWilling to travel domestically up to 10% of the year to customer site/ conferences (as needed)This position requires the ability to obtain and maintain a security clearance, which is issued by the U.S. government. U.S. citizenship is required to obtain a security clearanceHow You Can Stand Out It would be impressive if you have one or more of these:  Strong publication record and demonstrated ability to develop and execute innovative research projects, especially those related to microelectronics, is preferredProficiency with FIB-Time of Flight Secondary Ion Mass Spectroscopy (FIB-ToF-SIMS)Hands-on expertise in scanning transmission electron microscopy (STEM) and related techniques including diffractive 4D-STEM and EELSAdvanced skills in electron beam backscattered diffraction (EBSD), transmission Kikuchi diffraction (TKD), SEM electron beam induced current (EBIC), STEM-EBIC, and related fault isolation techniquesWorking knowledge of cryogenic SEM-related techniques and cathodoluminescenceDemonstrated capability with automated FIB operations including TEM sample preparation, serial cross-sectioning, 3D EBSD, circuit editing, and integrated circuit delayeringFamiliarity with e-beam lithographyBackground in Li-ion battery materials, including sample preparation and microscopy/mass spectroscopy characterizationTechnical knowledge of semiconductor integrated circuit layout and design, including PDK, DRC, DFM, VLSI architecture, BEOL technologies, and 3D/advanced chip packaging techniques is highly desiredProgramming skills in VHDL/Verilog/FPGA/microprocessor environmentsAn active TS/SCI  clearance, which is issued by the U.S. government, is strongly preferred. U.S. citizenship is required to obtain a security clearanceWe offer a competitive compensation package where yo