Director, Package Quality and Reliability

Our vision is to transform how the world uses information to enrich life for all.Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.Director, Package Quality & Reliability EngineeringJob SummaryThe Director, Package Quality & Reliability Engineering leads the execution and continuous improvement of package reliability, qualification, and failure analysis across new product introductions (NPI) and high-volume manufacturing (HVM).This role is responsible for ensuring robust package quality and reliability performance, identifying and mitigating key risks, and enabling successful product ramps across diverse application segments including mobile, automotive, data center, and AI/HPC.Working closely with Package Development Engineering (PDE), front-end fabrication, manufacturing, and quality teams, the role drives Design for Reliability (DFR), qualification rigor, and structured problem-solving at the chip-to-package interface, while building strong team capability and operational excellence.Main ResponsibilitiesPackage Quality & Reliability EngineeringLead execution of package reliability qualification for new product introductions and ongoing reliability monitoring in high-volume manufacturingIdentify and resolve key reliability risks, including chip-to-package interaction (CPI), interconnect reliability, thermo-mechanical stress, and material-related failure mechanismsDrive improvements in reliability test coverage and methodologies, aligned to end-use application requirements (e.g., automotive, mobile, data center)Ensure robust qualification processes, test plans, and reliability sign-off readinessCross-Functional CollaborationPartner with Package Development Engineering (PDE) to integrate Design for Reliability (DFR) and Design for Manufacturability (DFM) into package designCollaborate with front-end fab teams to address integration challenges across silicon and packaging interfacesWork with internal stakeholders and support customer engagements on package quality and reliability topicsRisk Assessment & DispositionProvide technical input and recommendations for risk assessment, including new package qualifications, process/material changes, and manufacturing excursionsLead or support failure analysis and root cause investigations using structured methodologies (e.g., 8D) for quality issues, qualification failures, and field returnsSupport data-driven evaluation of reliability performance and risk mitigation plansLeadership & Organization DevelopmentLead and develop a team of engineers focused on package reliability, qualification, and failure analysisDrive team capability building, training, and adherence to engineering and quality standardsEstablish clear operating rhythms, KPIs, and execution discipline to ensure consistent deliveryManage budgets and resource planning, including support for reliability testing infrastructureOther ResponsibilitiesSupport alignment across Product Engineering, Manufacturing, and Quality teams to ensure smooth product qualification and rampDrive continuous improvement initiatives in reliability methodologies, failure analysis, and operational processesContribute to strengthening reliability data analytics and digital capabilitiesProvide escalation support on critical reliability and quality issues impacting production or customer commitmentsSupport supplier interactions related to package reliability and materials performanceLeverage AI-enabled tools and data analytics to improve reliability insights, failure analysis efficiency, and decision-makingIdentify opportunities to enhance testing, monitoring, and risk detection using digital and predictive approachesPromote responsible adoption of AI to improve engineering productivity and outcomesCandidate Profile / Job RequirementsMinimum Required Qualifications / ExperienceBachelor’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, or related field (Master’s or Ph.D. preferred)12+ years of experience in semiconductor packaging, reliability, or manufacturing5+ years of experience in people management or technical leadership rolesExperience in high-volume manufacturing environments with exposure to package quality and reliabilityMust Have Technical SkillsStrong understanding of semiconductor packaging technologies and materialsExperience in package reliability test methodologies (e.g., temperature cycling, HAST, MSL/preconditioning, board-level reliability) and applicable standards (JEDEC, AEC-Q)Working knowledge of failure analysis techniques (e.g., cross-sectioning, SAM, X-ray, SEM/EDX) and root cause analysisUnderstanding of chip-to-package interaction, thermo-mechanical stress, and reliability failure mechanismsFamiliarity with qualification processes, reliability testing, and risk assessment approachesMust Have Soft SkillsStrong leadership and team development capabilitiesEffective collaboration across cross-functional engineering and manufacturing teamsStructured problem-solving and decision-making skillsClear communication skills with the ability to engage both technical and non-technical stakeholdersAbility to manage priorities and deliver results in a fast-paced environmentHighly Desirable / PreferredDemonstrates baseline digital fluency and ability to apply AI-enabled tools for data analysis, problem-solving, and operational improvementUses AI responsibly in line with organizational standards and governanceExperience with memory products (DRAM, NAND, HBM) in high-volume manufacturingExposure to advanced packaging technologies (e.g., system-in-package, hybrid bonding)Experience supporting a